Innovations Unveiled at ECOC 2024: Power-Efficient Solutions for the Future of Data Centers
FRANKFURT – This week, the ECOC 2024 tradeshow is buzzing with excitement as optical vendors showcase their latest innovations aimed at meeting the demands of hyper-scale data center operators. With the rapid growth of AI services and the expansion of traditional broadband providers, the focus is on delivering solutions that offer lower power consumption and greater capacity.
On the first day of the ECOC product showcase, several key players in the optical industry, including Ciena, DustPhotonics, Eoptolink, Fast Photonics, Marvell, OE Solutions, TeraSignal, and VIAVI, have unveiled their cutting-edge products. As the event unfolds, attendees can expect more announcements highlighting the latest advancements in optical technology.
Data Center and AI Focus
A significant theme emerging from this year’s showcase is the emphasis on products designed to support the burgeoning needs of hyperscaler providers, particularly in the realms of cloud computing and artificial intelligence (AI) applications.
Ciena’s 1.6 Tbps Coherent-Lite Pluggable
Ciena is making waves with its 1.6 Tbps Coherent-Lite pluggable solution, specifically targeting hyperscalers. This innovative product leverages the WaveLogic 6 Nano (WL6n) technology, which supports dual 800G data paths within a single digital signal processor (DSP) chip. The 3nm coherent ASIC used in the WL6n enables this impressive bandwidth, optimized for shorter-reach data center applications. Attendees can see the prototype of this groundbreaking pluggable solution at Ciena’s booth A14, with plans for electro-optic integration by the end of the year.
DustPhotonics’ Silicon Photonics Engine
DustPhotonics is also stepping into the spotlight with its new 1.6 Tbps silicon photonics engine. Designed for DR8 applications, this engine supports eight channels, each capable of operating at 224G/channel. A variant for 800 Gbps DR4 applications is also available. The products are tailored for various AI and hyperscale data center applications, with a standard version suitable for reaches of up to 2 km. A cost-effective option for short-reach applications will utilize a single laser, making it an attractive choice for many operators.
Eoptolink’s High-Bandwidth Transceivers
Eoptolink is introducing its OSFP 1.6 Tbps DR8 and 2FR4 Series Transceivers, which are designed to elevate the capabilities of AI/ML clusters and cloud data centers. These transceivers feature eight electrical host interfacing lanes and eight optical lanes, each operating at 212.5 Gbps. With transmission distances of up to 2 km without the need for regenerating forward error correction (FEC), these modules are set to enhance network performance significantly.
Fast Photonics’ SiPh-Based Transceiver
Fast Photonics is showcasing its SiPh-based 1.6 Tbps optical transceiver, which utilizes advanced silicon photonic integrated circuits. This transceiver is designed to reach distances of up to 2 km and is part of a product line that includes DSP, LPO, and LRO solutions. Fast Photonics is also addressing potential supply chain disruptions by offering products from dual manufacturing sites, ensuring reliability and availability.
New Optical Solutions
OE Solutions’ ELSFP Module
OE Solutions has unveiled its External Laser Small Form Factor (ELSFP) module, which incorporates Co-Packaged Optics (CPO) technology. This innovative solution is designed to provide sufficient optical power for optical engines used in switches and AI applications. The ELSFP’s compact size and low power consumption make it ideal for data centers, metro networks, and 5G infrastructure. Sampling for select customers is expected in Q4 2024, with general availability anticipated in the first half of 2025.
TeraSignal’s TSLink Interconnect
TeraSignal has introduced TSLink, an intelligent chip-to-module (C2M) interconnect that simplifies data transmission between large ASICs and linear optical modules. This solution automates link training and performance monitoring, significantly reducing power consumption and latency. TeraSignal is offering TSLink reference designs to select partners, with broader availability expected later this year.
Advancements in Test and Measurement
In addition to the innovative transceiver and optical solutions, test and measurement companies are also making strides in developing new tools to measure network performance.
VIAVI’s FVAM 2000
VIAVI has launched the FVAM-2000, an advanced optical connector inspection solution tailored for next-generation transceivers. This benchtop microscopy solution addresses the growing need for inspection methods that accommodate parallel optic connectors, such as MPO, which are integral to 800G formats. The FVAM-2000 features an easy-to-attach connector interface and an advanced automation framework, making it a critical tool for high-volume manufacturing environments.
As ECOC 2024 continues, the spotlight remains on the innovations that are shaping the future of optical technology, particularly in the context of data centers and AI applications. With each new product announcement, the industry moves closer to meeting the demands of an increasingly connected world.